Home / Connectors, Interconnects / Sockets for ICs, Transistors

Sockets for ICs, Transistors（23,193）

Manufacturer

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Amphenol ICC (FCI)

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Analog Devices Inc./Maxim Integrated

false

Apex Microtechnology

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Aries Electronics

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Assmann WSW Components

false

CNC Tech

false

EDAC Inc.

false

Essentra Components

false

Grayhill Inc.

false

Type

Axial

BGA

CLCC

Camera Socket

DIP, 0.1" (2.54mm) Row Spacing

DIP, 0.2" (5.08mm) Row Spacing

DIP, 0.3" (7.62mm) Row Spacing

DIP, 0.4" (10.16mm) Row Spacing

DIP, 0.5 to 0.6" Row Spacing

Series

100

101

104

110

Features

7 Plates

Board Guide

Board Guide, Closed Frame

Board Guide, Flange

Board Guide, Open Frame

Carrier

Carrier, Closed Frame

Carrier, Elevated

Carrier, Open Frame

Termination

Press-Fit

Solder

Solder Cup

Wire Wrap

Pitch - Post

0.016" (0.40mm)

0.020" (0.50mm)

0.024" (0.60mm)

0.025" (0.64mm)

0.028" (0.70mm)

0.031" (0.80mm)

0.033" (0.85mm)

0.034" (0.86mm)

0.035" (0.90mm)

Mounting Type

Chassis Mount

Connector

Panel Mount

Surface Mount

Surface Mount, Through Board

Threaded

Through Hole

Through Hole, Bottom Entry; Through Board

Through Hole, Kinked Pin

Pitch - Mating

0.016" (0.40mm)

0.020" (0.50mm)

0.024" (0.60mm)

0.025" (0.64mm)

0.026" (0.65mm)

0.026" ~ 0.050" (0.65mm ~ 1.27mm)

0.028" (0.70mm)

0.031" (0.80mm)

0.033" (0.85mm)

Housing Material

Aluminum Alloy

Diallyl Phthalate (DAP)

FR4 Epoxy Glass

Fluoropolymer (FP)

Liquid Crystal Polymer (LCP)

Liquid Crystal Polymer (LCP), Glass Filled

Phenolic

Plastic

Polyamide (PA), Nylon

Contact Finish - Post

Copper

Gold

Nickel

Nickel Boron

Nickel Bronze

Silver

Tin

Tin-Lead

Operating Temperature

-25°C ~ 100°C

-25°C ~ 85°C

-30°C ~ 85°C

-40°C ~ 105°C

-40°C ~ 125°C

-40°C ~ 75°C

-40°C ~ 80°C

-50°C ~ 105°C

-50°C ~ 175°C

Contact Finish - Mating

Custom

Gold

Nickel

Nickel Boron

Silver

Tin

Tin-Lead

Contact Material - Post

Beryllium Copper

Beryllium Nickel

Brass

Brass Alloy

Brass, Copper

Bronze

Copper

Copper Alloy

Nickel

Contact Material - Mating

Beryllium Copper

Beryllium Nickel

Brass

Copper

Copper Alloy

Nickel Boron

Phosphor Bronze

Phosphor Bronze Alloy

Contact Finish Thickness - Post

1.00µin (0.025µm)

10.0µin (0.25µm)

100.0µin (2.54µm)

118.1µin (3.00µm)

135.0µin (3.43µm)

15.0µin (0.38µm)

150.0µin (3.81µm)

160.0µin (4.06µm)

180.0µin (4.57µm)

Contact Finish Thickness - Mating

1.00µin (0.025µm)

10.0µin (0.25µm)

100.0µin (2.54µm)

12.0µin (0.30µm)

135.0µin (3.43µm)

15.0µin (0.38µm)

150.0µin (3.81µm)

160.0µin (4.06µm)

180.0µin (4.57µm)

Number of Positions or Pins (Grid)

1 (1 x 1)

10 (1 x 10)

10 (2 x 5)

10 (2 x 5), 6 Loaded

10 (2 x 5), 8 Loaded

10 (Round)

100 (10 x 10)

100 (11 x 11)

Filter results: 23,193

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Product	Manufacturer	Package	Batch	RoHS	Effective inventory	Quantity	RFQ
S583-11-255-01-005410	S583-11-255-01-005410 Mill-Max Manufacturing Corp. - - RFQ	Mill-Max Manufacturing Corp.	-	-		-
84-537-21	84-537-21 Aries Electronics - - RFQ	Aries Electronics	-	-		-
1-1437569-3	1-1437569-3 TE Connectivity ALCOSWITCH Switches - - RFQ	TE Connectivity ALCOSWITCH Switches	-	-		-
S582-11-898-15-001414	S582-11-898-15-001414 Mill-Max Manufacturing Corp. - - RFQ	Mill-Max Manufacturing Corp.	-	-		-
44-547-11	44-547-11 Aries Electronics - - RFQ	Aries Electronics	-	-		-
44-547-11E	44-547-11E Aries Electronics - - RFQ	Aries Electronics	-	-		-
288-4205-01	288-4205-01 3M - - RFQ	3M	-	-		-
441-PRS21001-12	441-PRS21001-12 Aries Electronics - - RFQ	Aries Electronics	-	-		-
280-5205-01	280-5205-01 3M - - RFQ	3M	-	-		-
260-4204-01	260-4204-01 3M - - RFQ	3M	-	-		-