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THERM PAD 609.6X457.2MM W/ADH
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Quantity:
PIC16LC622T-04I/SO
Microchip Technology
TW-04-03-G-D-200-SM-P
Samtec Inc.
68004-416HLF
Amphenol ICC (FCI)
PNF14-8F-3K
Panduit Corp
DBMA25S
Cinch Connectivity Solutions
