0402
16nH +/-2% Ceramic Core Chip Ind
Please send RFQ , we will respond immediately.
Quantity:
FPA.2B.306.CYCD52Z
LEMO
621-037-260-051
EDAC Inc.
GMM43DRYH
Sullins Connector Solutions
806-040-ZR14E22G20ASCE
Glenair
40811
Brady Corporation
