QSE-028-01-L-D-DP

Samtec Inc.

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QSE-028-01-L-D-DP

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CONN DIFF ARRAY RCP 56P SMD GOLD

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Number of Rows	2
Number of Positions	56
Contact Finish Thickness	10.0µin (0.25µm)
Contact Finish	Gold
Height Above Board	0.128" (3.25mm)
Mounting Type	Surface Mount
Product Status	Active
Series	Q Strip® QSE
Pitch	0.031" (0.80mm)
Mfr	Samtec Inc.
Connector Type	Differential Pair Array, Female
Features	Ground Bus (Plane)
Package	Tray
Mated Stacking Heights	5mm, 8mm, 11mm, 14mm, 16mm, 19mm, 25mm
Base Product Number	QSE-028