100-008-051

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100-008-051

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CONN IC DIP SOCKET 8POS GOLD

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Contact Finish - Mating	Gold
Operating Temperature	-65°C ~ 125°C
Contact Material - Post	Brass
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Current Rating (Amps)	1 A
Contact Finish Thickness - Mating	8.00µin (0.203µm)
Termination	Solder
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Product Status	Obsolete
Number of Positions or Pins (Grid)	8 (2 x 4)
Contact Finish Thickness - Post	Flash
Pitch - Post	0.100" (2.54mm)
Series	100
Type	DIP, 0.3" (7.62mm) Row Spacing
Contact Finish - Post	Gold
Mfr	3M
Termination Post Length	0.126" (3.20mm)
Pitch - Mating	0.100" (2.54mm)
Contact Material - Mating	Beryllium Copper
Features	Closed Frame, Seal Tape
Package	Bulk
Contact Resistance	-
Base Product Number	100-008