BDN09-3CB

CTS Thermal Management Products

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BDN09-3CB

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HEATSINK CPU .91" SQ

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Shape	Square, Pin Fins
Material	Aluminum
Product Status	Active
Fin Height	0.355" (9.02mm)
Series	BDN
Thermal Resistance @ Forced Air Flow	9.60°C/W @ 400 LFM
Type	Top Mount
Length	0.910" (23.11mm)
Mfr	CTS Thermal Management Products
Thermal Resistance @ Natural	26.90°C/W
Package	Box
Material Finish	Black Anodized
Attachment Method	Thermal Tape, Adhesive (Not Included)
Width	0.910" (23.11mm)
Diameter	-
Power Dissipation @ Temperature Rise	-
Package Cooled	Assorted (BGA, LGA, CPU, ASIC...)
Base Product Number	BDN09