BDN09-3CB/A01

CTS Thermal Management Products

Product No:

BDN09-3CB/A01

Manufacturer:

Package:

Batch:

Datasheet:

Description:

HEATSINK CPU W/ADHESIVE .91"SQ

Quantity:

Delivery:

Payment:

In Stock : Please Inquiry

Please send RFQ , we will respond immediately.

Contact Name

Company name

Telephone

Country

Quantity

Shape	Square, Pin Fins
Material	Aluminum
Product Status	Active
Fin Height	0.355" (9.02mm)
Series	BDN
Thermal Resistance @ Forced Air Flow	9.60°C/W @ 400 LFM
Type	Top Mount
Length	0.910" (23.11mm)
Mfr	CTS Thermal Management Products
Thermal Resistance @ Natural	26.90°C/W
Shelf Life	24 Months
Package	Box
Material Finish	Black Anodized
Attachment Method	Thermal Tape, Adhesive (Included)
Width	0.910" (23.11mm)
Diameter	-
Power Dissipation @ Temperature Rise	-
Package Cooled	Assorted (BGA, LGA, CPU, ASIC...)
Base Product Number	BDN09