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ESQ-130-39-L-T

Samtec Inc.

Product No:

ESQ-130-39-L-T

Manufacturer:

Samtec Inc.

Package:

-

Batch:

-

Datasheet:

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Description:

CONN SOCKET 90POS 0.1 GOLD PCB

Quantity:

Delivery:

1.webp 4.webp 5.webp 2.webp 3.webp

Payment:

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In Stock : Please Inquiry

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Product Information

Parameter Info

User Guide

Insulation Height 0.435" (11.05mm)
Ingress Protection -
Voltage Rating 550VAC
Current Rating (Amps) 5.7A per Contact
Contact Finish Thickness - Mating 10.0µin (0.25µm)
Contact Type Forked
Material Flammability Rating UL94 V-0
Product Status Active
Mfr Samtec Inc.
Connector Type Elevated Socket
Contact Material Phosphor Bronze
Style Board to Board
Pitch - Mating 0.100" (2.54mm)
Features -
Contact Finish - Mating Gold
Operating Temperature -55°C ~ 125°C
Number of Rows 3
Applications -
Number of Positions 90
Termination Solder
Fastening Type Push-Pull
Mounting Type Through Hole
Contact Finish Thickness - Post -
Insulation Material Liquid Crystal Polymer (LCP)
Contact Shape Square
Series ESQ
Row Spacing - Mating 0.100" (2.54mm)
Contact Finish - Post Tin
Insulation Color Black
Contact Length - Post 0.480" (12.19mm)
Number of Positions Loaded All
Mated Stacking Heights -
Package Bulk
Base Product Number ESQ-130