ESQ-130-58-G-T-LL

Samtec Inc.

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ESQ-130-58-G-T-LL

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CONN SOCKET 90POS 0.1 GOLD PCB

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Insulation Height	0.535" (13.60mm)
Ingress Protection	-
Voltage Rating	550VAC
Current Rating (Amps)	5.7A per Contact
Contact Finish Thickness - Mating	20.0µin (0.51µm)
Contact Type	Forked
Material Flammability Rating	UL94 V-0
Product Status	Active
Mfr	Samtec Inc.
Connector Type	Elevated Socket
Contact Material	Phosphor Bronze
Style	Board to Board
Pitch - Mating	0.100" (2.54mm)
Features	-
Contact Finish - Mating	Gold
Operating Temperature	-55°C ~ 125°C
Number of Rows	3
Applications	-
Number of Positions	90
Termination	Kinked Pin, Solder
Fastening Type	Push-Pull
Mounting Type	Through Hole
Contact Finish Thickness - Post	3.00µin (0.076µm)
Insulation Material	Liquid Crystal Polymer (LCP)
Contact Shape	Square
Series	ESQ
Row Spacing - Mating	0.100" (2.54mm)
Contact Finish - Post	Gold
Insulation Color	Black
Contact Length - Post	0.380" (9.65mm)
Number of Positions Loaded	All
Mated Stacking Heights	-
Package	Bulk
Base Product Number	ESQ-130