IW-HSKALU-CLASLR-CU03

iWave Systems

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ZU+ MPSOC SOM MODULE HEATSINK

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Shape	Rectangular, Fins
Material	Aluminum
Product Status	Active
Fin Height	1.181" (30.00mm)
Series	-
Type	Top Mount
Thermal Resistance @ Forced Air Flow	-
Length	3.740" (95.00mm)
Mfr	iWave Systems
Thermal Resistance @ Natural	-
Package	Bulk
Material Finish	-
Attachment Method	Bolt On
Width	2.953" (75.00mm)
Diameter	-
Power Dissipation @ Temperature Rise	-
Package Cooled	FPGA