NC191LTA35

Chip Quik Inc.

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NC191LTA35

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Description:

SMOOTH FLOW LOW TEMP SOLDER PAST

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Storage/Refrigeration Temperature	37°F ~ 46°F (3°C ~ 8°C)
Composition	Bi57Sn42Ag1 (57/42/1)
Form	Syringe, 1.23 oz (35g), 10cc
Process	-
Wire Gauge	-
Product Status	Active
Flux Type	No-Clean
Series	Smooth Flow™
Type	Solder Paste
Mesh Type	4
Shelf Life Start	Date of Manufacture
Mfr	Chip Quik Inc.
Shelf Life	12 Months
Package	Bulk
Diameter	-
Melting Point	279°F (137°C)
Base Product Number	NC191