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PA0170

Chip Quik Inc.

Product No:

PA0170

Manufacturer:

Chip Quik Inc.

Package:

-

Batch:

-

Datasheet:

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Description:

MINI SOIC-8 EXP PAD TO DIP-8 SMT

Quantity:

Delivery:

1.webp 4.webp 5.webp 2.webp 3.webp

Payment:

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In Stock : Please Inquiry

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Product Information

Parameter Info

User Guide

Series Proto-Advantage
Number of Positions 8
Package Accepted MiniSOIC EP
Pitch 0.026" (0.65mm)
Mfr Chip Quik Inc.
Proto Board Type SMD to DIP
Material FR4 Epoxy Glass
Package Bulk
Size / Dimension 0.700" x 0.400" (17.78mm x 10.16mm)
Product Status Active
Board Thickness 0.062" (1.57mm) 1/16"