Chip Quik Inc.
Product No:
SBB0802P-1
Manufacturer:
Package:
-
Batch:
-
Datasheet:
-
Description:
SOLDER-IN BREADBOARD 1X1" (8 ROW
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Material | FR4 Epoxy Glass |
Size / Dimension | 1.00" L x 1.00" W (25.4mm x 25.4mm) |
Product Status | Active |
Series | Proto-Advantage |
Circuit Pattern | Pad Per Hole (Round) |
Pitch | 0.1" (2.54mm) Grid |
Mfr | Chip Quik Inc. |
Plating | Plated Through Hole (PTH) |
Proto Board Type | Breadboard, General Purpose |
Hole Diameter | 0.039" (1.00mm) |
Package | Bulk |
Edge Contacts | - |
Board Thickness | 0.063" (1.60mm) |