SMD291SNL50T6

Chip Quik Inc.

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SMD291SNL50T6

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Description:

SOLDER PASTE IN JAR 50G (T6) SAC

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Storage/Refrigeration Temperature	37°F ~ 46°F (3°C ~ 8°C)
Composition	Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Form	Jar, 1.76 oz (50g)
Process	Lead Free
Wire Gauge	-
Product Status	Active
Flux Type	No-Clean
Series	SMD
Type	Solder Paste
Mesh Type	6
Shelf Life Start	Date of Manufacture
Mfr	Chip Quik Inc.
Shelf Life	6 Months
Package	Bulk
Diameter	-
Melting Point	422 ~ 428°F (217 ~ 220°C)
Base Product Number	SMD291