SPC5777CSK3MMO4

NXP USA Inc.

Product No:

SPC5777CSK3MMO4

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Package:

516-MAPBGA (27x27)

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Description:

POWER ARCH CORES, 8MB FLASH, 300

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Core Processor	e200z7
Operating Temperature	-40°C ~ 125°C (TA)
Speed	300MHz
Program Memory Type	FLASH
RAM Size	512K x 8
Peripherals	DMA, LVD, POR, Zipwire
Mounting Type	Surface Mount
Product Status	Active
Supplier Device Package	516-MAPBGA (27x27)
Oscillator Type	External, Internal
EEPROM Size	-
Series	Automotive, AEC-Q100 MPC57xx
Package / Case	516-BGA
Core Size	32-Bit Tri-Core
Mfr	NXP USA Inc.
Connectivity	CANbus, EBI/EMI, Ethernet, PSI5, SENT, SPI
Program Memory Size	8MB (8M x 8)
Package	Tray
Data Converters	A/D 10x16b Sigma-Delta, eQADC
Voltage - Supply (Vcc/Vdd)	3V ~ 5.5V