TS391SNL50

Chip Quik Inc.

Product No:

TS391SNL50

Manufacturer:

Package:

Batch:

Datasheet:

Description:

THERMALLY STABLE SOLDER PASTE NO

Quantity:

Delivery:

Payment:

In Stock : Please Inquiry

Please send RFQ , we will respond immediately.

Contact Name

Company name

Telephone

Country

Quantity

Storage/Refrigeration Temperature	68°F ~ 77°F (20°C ~ 25°C)
Composition	Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Form	Jar, 1.76 oz (50g)
Process	Lead Free
Wire Gauge	-
Product Status	Active
Flux Type	No-Clean
Series	-
Type	Solder Paste
Mesh Type	4
Shelf Life Start	Date of Manufacture
Shipping Info	-
Mfr	Chip Quik Inc.
Shelf Life	12 Months
Package	Bulk
Diameter	-
Melting Point	423 ~ 428°F (217 ~ 220°C)
Base Product Number	TS391S