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TSX713

EDSYN INCORPORATED

Product No:

TSX713

Manufacturer:

EDSYN INCORPORATED

Package:

-

Batch:

-

Datasheet:

-

Description:

REFLOW VACUUM TIP, HOLE DIA: 1.3

Quantity:

Delivery:

1.webp 4.webp 5.webp 2.webp 3.webp

Payment:

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In Stock : Please Inquiry

Please send RFQ , we will respond immediately.

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Product Information

Parameter Info

User Guide

Tip Chip Size -
Tip Type Rework
Product Status Active
Series SOLDAVAC®
For Use With/Related Products -
Length 0.551" (14.00mm)
Mfr EDSYN INCORPORATED
Temperature Range -
Height -
Package Bag
Tip Shape Nozzle
Width -
Diameter 0.051" (1.30mm)