EDSYN INCORPORATED
Product No:
TSX713
Manufacturer:
Package:
-
Batch:
-
Datasheet:
-
Description:
REFLOW VACUUM TIP, HOLE DIA: 1.3
Quantity:
Delivery:
Payment:
Please send RFQ , we will respond immediately.
Tip Chip Size | - |
Tip Type | Rework |
Product Status | Active |
Series | SOLDAVAC® |
For Use With/Related Products | - |
Length | 0.551" (14.00mm) |
Mfr | EDSYN INCORPORATED |
Temperature Range | - |
Height | - |
Package | Bag |
Tip Shape | Nozzle |
Width | - |
Diameter | 0.051" (1.30mm) |