UCR01MVPFLR330

Rohm Semiconductor

Product No:

UCR01MVPFLR330

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Package:

0402

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Description:

THICK FILM LOW OHMIC CHIP RESIST

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Operating Temperature	-55°C ~ 155°C
Composition	Thick Film
Height - Seated (Max)	0.017" (0.42mm)
Tolerance	±1%
Temperature Coefficient	0/ +200ppm/°C
Size / Dimension	0.039" L x 0.022" W (1.00mm x 0.55mm)
Product Status	Active
Supplier Device Package	0402
Ratings	AEC-Q200
Resistance	330 mOhms
Power (Watts)	0.125W, 1/8W
Series	UCR
Package / Case	0402 (1005 Metric)
Mfr	Rohm Semiconductor
Number of Terminations	2
Features	Automotive AEC-Q200, Current Sense
Failure Rate	-
Package	Tape & Reel (TR)