WS991SNL35T4

Chip Quik Inc.

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WS991SNL35T4

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Description:

THERMALLY STABLE SOLDER PASTE WS

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Storage/Refrigeration Temperature	37°F ~ 77°F (3°C ~ 25°C)
Composition	Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Form	Syringe, 1.23 oz (34.869g)
Process	-
Wire Gauge	-
Product Status	Active
Weight	-
Flux Type	Water Soluble
Series	CHIPQUIK®
Type	Solder Paste
Mesh Type	4
Shelf Life Start	Date of Manufacture
Shipping Info	-
Mfr	Chip Quik Inc.
Shelf Life	12 Months
Package	Bulk
Diameter	-
Melting Point	423°F (217°C)