Chip Quik Inc.
Product No:
WS991SNL500T4
Manufacturer:
Package:
-
Batch:
-
Description:
SOLDER PASTE THERMALLY STABLE WS
Quantity:
Delivery:
Payment:
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Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Form | Jar, 17.64 oz (500g) |
Process | Lead Free |
Wire Gauge | - |
Product Status | Active |
Flux Type | Water Soluble |
Series | CHIPQUIK® |
Type | Solder Paste |
Mesh Type | 4 |
Shelf Life Start | Date of Manufacture |
Mfr | Chip Quik Inc. |
Shelf Life | 6 Months |
Package | Bulk |
Diameter | - |
Melting Point | 423°F (217°C) |
Base Product Number | WS991 |