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Edgeboard Connectors（641,688）

Manufacturer

false

ATTEND Technology

false

Amphenol ICC (Commercial Products)

false

Amphenol ICC (FCI)

false

CW Industries

false

CarlisleIT

false

Cinch Connectivity Solutions

false

Conec

false

EDAC Inc.

false

HARTING

false

Color

Black

Blue

Brown

Gray

Green

Green (Dark Green)

Ivory

Natural

Orange

Pitch

0.020" (0.50mm)

0.024" (0.60mm)

0.025" (0.64mm)

0.026" (0.65mm)

0.029" (0.75mm)

0.030" (0.76mm)

0.031" (0.80mm)

0.039" (1.00mm)

0.050" (1.27mm)

Gender

Female

Male

Series

170

171

243

301

305

306

307

310

Features

Bi-Level - High Density

Bi-Level - High Density, Board Lock

Bi-Level - High Density, Card Extender

Board Guide

Board Guide, Board Lock

Board Guide, Board Lock, Card Extender

Board Guide, Board Lock, Latch, Locking Ramp

Board Guide, Board Lock, Latches

Board Guide, Board Lock, Locking Ramp

Read Out

Dual

Single

Card Type

AGP

AGP Pro 1.5V

AGP Pro Universal

AGP, Universal

Advanced Mezzanine Card B+, MicroTCA

CPU - Slot 1

Computerbus

Fits Female Edgecards

ISA

Termination

Crimp

IDC

Kinked Pin, Solder

Press-Fit

Press-Fit, Wire Wrap

Solder

Solder Eyelet(s)

Solder, Staggered

Solder, Wire Wrap

Contact Type

Bifurcated Semi Bellows

Cantilever

Cantilever with Back-Up Spring

Cantilever, Make Before Break

Full Bellows

Full Bellows with Back-Up Spring

Hairpin Bellows

Hairpin Bellows, Make Before Break

Loop Bellows

Mounting Type

Board Edge, Straddle Mount

Board Edge, Through Hole

Board Edge, Through Hole, Right Angle

Free Hanging (In-Line)

Panel Mount

Panel Mount, Through Hole

Surface Mount

Surface Mount, Right Angle

Surface Mount, Through Hole

Card Thickness

0.031" (0.79mm)

0.031" (0.80mm)

0.032" ~ 0.070" (0.81mm ~ 1.78mm)

0.039" (1.00mm)

0.047" (1.20mm)

0.050" (1.27mm)

0.051" ~ 0.067" (1.30mm ~ 1.70mm)

0.054" ~ 0.070" (1.37mm ~ 1.78mm)

0.054" ~ 0.071" (1.37mm ~ 1.80mm)

Contact Finish

Gold

Gold or Gold, GXT™

Gold or Gold-Palladium

Gold, GXT™

Gold-Palladium

Tin

Tin-Lead

Flange Feature

Flush Mount, Floating Bobbin, 0.116" (2.95mm) Dia

Flush Mount, Side Opening, Unthreaded, 0.125" (3.18mm) Dia

Flush Mount, Side Opening, Unthreaded, 0.128" (3.25mm) Dia

Flush Mount, Side Opening, Unthreaded, 0.145" (3.68mm) Dia

Flush Mount, Side Opening, Unthreaded, 0.146" (3.70mm) Dia

Flush Mount, Top Opening, Threaded Insert, 4-40

Flush Mount, Top Opening, Threaded Insert, M3

Flush Mount, Top Opening, Threaded Insert, M3-0.5

Flush Mount, Top Opening, Unthreaded, 0.125" (3.18mm) Dia

Number of Rows

Contact Material

Beryllium Copper

Beryllium Nickel

Brass

Copper

Copper Alloy

Copper, Nickel, Tin Alloy

Copper, Phosphor Bronze

Phosphor Bronze

Phosphor Bronze - Tin Plated

Number of Positions

10 (6 Loaded)

10 (8 + 2 Power)

10 (8 Loaded)

10 (Power)

100 (99 Loaded)

104 (100 + 4 Power)

Operating Temperature

-10°C ~ 85°C

-20°C ~ 105°C

-20°C ~ 80°C

-20°C ~ 85°C

-30°C ~ 85°C

-40°C ~ 100°C

-40°C ~ 105°C

-40°C ~ 125°C

-40°C ~ 80°C

Contact Finish Thickness

1.00µin (0.025µm)

10.0µin (0.25µm)

100.0µin (2.54µm)

11.8µin (0.30µm)

118.1µin (3.00µm)

145.7µin (3.70µm)

15.0µin (0.38µm)

16.0µin (0.41µm)

2.00µin (0.051µm)

Number of Positions/Bay/Row

10; 10

10; 12

10; 12; 10

10; 13

10; 18

10; 2

10; 20

Filter results: 641,688

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