CUI Devices HSB17-404025

HSB17-404025

-

HEAT SINK, BGA, 40 X 40 X 25 MM

In Stock : Please Inquiry

Please send RFQ , we will respond immediately.

Contact Name

Email

Company name

Telephone

Country

Quantity:

Hot Datasheet

A7D-106

Omron Electronics Inc-EMC Div

MAX4627EUK+T

Analog Devices Inc./Maxim Integrated

MFR-12FTF52-464K

YAGEO

RN73H1JTTD49R9F25

KOA Speer Electronics, Inc.

FN3287-25-33-C21-R65

Schaffner EMC Inc.