HSB17-404025

CUI Devices

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HSB17-404025

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HEAT SINK, BGA, 40 X 40 X 25 MM

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Shape	Square, Pin Fins
Material	Aluminum Alloy
Product Status	Active
Fin Height	0.984" (25.00mm)
Series	HSB
Type	Top Mount
Thermal Resistance @ Forced Air Flow	2.10°C/W @ 200 LFM
Length	1.575" (40.00mm)
Mfr	CUI Devices
Thermal Resistance @ Natural	6.41°C/W
Package	Box
Material Finish	Black Anodized
Attachment Method	Adhesive
Width	1.575" (40.00mm)
Diameter	-
Power Dissipation @ Temperature Rise	11.7W @ 75°C
Package Cooled	BGA