CUI Devices
Product No:
HSS13-B20-NP
Manufacturer:
Package:
-
Batch:
-
Description:
HEAT SINK, STAMPING, TO-220, 31
Quantity:
Delivery:
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Shape | Rectangular |
Material | Aluminum Alloy |
Product Status | Active |
Fin Height | 0.508" (12.90mm) |
Series | HSS |
Type | Board Level, Vertical |
Thermal Resistance @ Forced Air Flow | 7.70°C/W @ 200 LFM |
Length | 1.220" (31.00mm) |
Mfr | CUI Devices |
Thermal Resistance @ Natural | 15.50°C/W |
Package | Box |
Material Finish | Black Anodized |
Attachment Method | - |
Width | 0.994" (25.25mm) |
Diameter | - |
Power Dissipation @ Temperature Rise | 4.8W @ 75°C |
Package Cooled | TO-220 |