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HSS13-B20-NP

CUI Devices

Product No:

HSS13-B20-NP

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

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Description:

HEAT SINK, STAMPING, TO-220, 31

Quantity:

Delivery:

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Payment:

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In Stock : Please Inquiry

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Product Information

Parameter Info

User Guide

Shape Rectangular
Material Aluminum Alloy
Product Status Active
Fin Height 0.508" (12.90mm)
Series HSS
Type Board Level, Vertical
Thermal Resistance @ Forced Air Flow 7.70°C/W @ 200 LFM
Length 1.220" (31.00mm)
Mfr CUI Devices
Thermal Resistance @ Natural 15.50°C/W
Package Box
Material Finish Black Anodized
Attachment Method -
Width 0.994" (25.25mm)
Diameter -
Power Dissipation @ Temperature Rise 4.8W @ 75°C
Package Cooled TO-220