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HSS20-B20-NP

CUI Devices

Product No:

HSS20-B20-NP

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

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Description:

HEAT SINK, STAMPING, TO-218/TO-2

Quantity:

Delivery:

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Payment:

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In Stock : Please Inquiry

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Product Information

Parameter Info

User Guide

Shape Rectangular, Fins
Material Aluminum Alloy
Product Status Active
Fin Height 0.433" (11.00mm)
Series HSS
Type Top Mount
Thermal Resistance @ Forced Air Flow 11.20°C/W @ 200 LFM
Length 0.866" (22.00mm)
Mfr CUI Devices
Thermal Resistance @ Natural 26.40°C/W
Package Bag
Material Finish Black Anodized
Attachment Method Bolt On
Width 0.748" (19.00mm)
Diameter -
Power Dissipation @ Temperature Rise 2.84W @ 75°C
Package Cooled TO-218, TO-220