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HSB18-232310

CUI Devices

Product No:

HSB18-232310

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

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Description:

HEAT SINK, BGA, 23 X 23 X 10 MM

Quantity:

Delivery:

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Payment:

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In Stock : Please Inquiry

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Product Information

Parameter Info

User Guide

Shape Square, Pin Fins
Material Aluminum Alloy
Product Status Active
Fin Height 0.394" (10.00mm)
Series HSB
Type Top Mount
Thermal Resistance @ Forced Air Flow 6.80°C/W @ 200 LFM
Length 0.906" (23.00mm)
Mfr CUI Devices
Thermal Resistance @ Natural 20.41°C/W
Package Box
Material Finish Black Anodized
Attachment Method Adhesive
Width 0.906" (23.00mm)
Diameter -
Power Dissipation @ Temperature Rise 3.7W @ 75°C
Package Cooled BGA