CUI Devices
Product No:
HSB18-232310
Manufacturer:
Package:
-
Batch:
-
Description:
HEAT SINK, BGA, 23 X 23 X 10 MM
Quantity:
Delivery:
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Shape | Square, Pin Fins |
Material | Aluminum Alloy |
Product Status | Active |
Fin Height | 0.394" (10.00mm) |
Series | HSB |
Type | Top Mount |
Thermal Resistance @ Forced Air Flow | 6.80°C/W @ 200 LFM |
Length | 0.906" (23.00mm) |
Mfr | CUI Devices |
Thermal Resistance @ Natural | 20.41°C/W |
Package | Box |
Material Finish | Black Anodized |
Attachment Method | Adhesive |
Width | 0.906" (23.00mm) |
Diameter | - |
Power Dissipation @ Temperature Rise | 3.7W @ 75°C |
Package Cooled | BGA |