CUI Devices
Product No:
HSS25-B20-P51
Manufacturer:
Package:
-
Batch:
-
Description:
HEAT SINK, STAMPING, TO-218/TO-2
Quantity:
Delivery:
Payment:
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Shape | Square, Fins |
Material | Aluminum Alloy |
Product Status | Active |
Fin Height | 1.673" (42.50mm) |
Series | HSS |
Type | Board Level |
Thermal Resistance @ Forced Air Flow | 6.30°C/W @ 200 LFM |
Length | 1.000" (25.40mm) |
Mfr | CUI Devices |
Thermal Resistance @ Natural | 12.75°C/W |
Package | Box |
Material Finish | Black Anodized |
Attachment Method | PC Pin |
Width | 1.000" (25.40mm) |
Diameter | - |
Power Dissipation @ Temperature Rise | 5.88W @ 75°C |
Package Cooled | TO-218, TO-220 |