CUI Devices
Product No:
HSB16-404018
Manufacturer:
Package:
-
Batch:
-
Description:
HEAT SINK, BGA, 40 X 40 X 18 MM
Quantity:
Delivery:
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Shape | Square, Pin Fins |
Material | Aluminum Alloy |
Product Status | Active |
Fin Height | 0.709" (18.00mm) |
Series | HSB |
Type | Top Mount |
Thermal Resistance @ Forced Air Flow | 2.60°C/W @ 200 LFM |
Length | 1.575" (40.00mm) |
Mfr | CUI Devices |
Thermal Resistance @ Natural | 7.96°C/W |
Package | Box |
Material Finish | Black Anodized |
Attachment Method | Adhesive |
Width | 1.575" (40.00mm) |
Diameter | - |
Power Dissipation @ Temperature Rise | 9.4W @ 75°C |
Package Cooled | BGA |