CUI Devices
Product No:
HSB20-353525
Manufacturer:
Package:
-
Batch:
-
Description:
HEAT SINK, BGA, 35 X 35 X 25 MM
Quantity:
Delivery:
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Shape | Square, Pin Fins |
Material | Aluminum Alloy |
Product Status | Active |
Fin Height | 0.984" (25.00mm) |
Series | HSB |
Type | Top Mount |
Thermal Resistance @ Forced Air Flow | 2.70°C/W @ 200 LFM |
Length | 1.378" (35.00mm) |
Mfr | CUI Devices |
Thermal Resistance @ Natural | 6.65°C/W |
Package | Box |
Material Finish | Black Anodized |
Attachment Method | Adhesive |
Width | 1.378" (35.00mm) |
Diameter | - |
Power Dissipation @ Temperature Rise | 11.3W @ 75°C |
Package Cooled | BGA |