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HSE-B18317-035H

CUI Devices

Product No:

HSE-B18317-035H

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

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Description:

HEAT SINK, EXTRUSION, TO-218, 31

Quantity:

Delivery:

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Payment:

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In Stock : Please Inquiry

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Product Information

Parameter Info

User Guide

Shape Rectangular, Angled Fins
Material Aluminum Alloy
Product Status Active
Fin Height 0.984" (25.00mm)
Series HSE
Thermal Resistance @ Forced Air Flow 3.63°C/W @ 200 LFM
Type Board Level, Vertical
Length 1.250" (31.75mm)
Mfr CUI Devices
Thermal Resistance @ Natural 7.65°C/W
Package Box
Material Finish Black Anodized
Attachment Method Bolt On and PC Pin
Width 1.638" (41.60mm)
Diameter -
Power Dissipation @ Temperature Rise 9.8W @ 75°C
Package Cooled TO-218
Base Product Number HSE-B18317