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HSE01-193175

CUI Devices

Product No:

HSE01-193175

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

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Description:

HEAT SINK, EXTRUSION, 19 X 31.5

Quantity:

Delivery:

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Payment:

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In Stock : Please Inquiry

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Product Information

Parameter Info

User Guide

Shape Square, Angled Fins
Material Aluminum Alloy
Product Status Active
Fin Height 0.295" (7.50mm)
Series HSE
Type Top Mount
Thermal Resistance @ Forced Air Flow 9.20°C/W @ 200 LFM
Length 0.748" (19.00mm)
Mfr CUI Devices
Thermal Resistance @ Natural 25.44°C/W
Package Box
Material Finish Blue Anodized
Attachment Method Thermal Tape, Adhesive (Not Included)
Width 0.748" (19.00mm)
Diameter -
Power Dissipation @ Temperature Rise 2.95W @ 75°C
Package Cooled -