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HSE04-251265-2

CUI Devices

Product No:

HSE04-251265-2

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

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Description:

HEAT SINK, EXTRUSION, TO-218/TO-

Quantity:

Delivery:

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Payment:

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In Stock : Please Inquiry

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Product Information

Parameter Info

User Guide

Shape Rectangular, Fins
Material Aluminum Alloy
Product Status Active
Fin Height 0.256" (6.50mm)
Series HSE
Type Top Mount
Thermal Resistance @ Forced Air Flow 16.60°C/W @ 200 LFM
Length 0.984" (25.00mm)
Mfr CUI Devices
Thermal Resistance @ Natural 30.38°C/W
Package Bag
Material Finish Black Anodized
Attachment Method Bolt On
Width 0.472" (12.00mm)
Diameter -
Power Dissipation @ Temperature Rise 2.47W @ 75°C
Package Cooled TO-218, TO-220