HSE07-753045

CUI Devices

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HSE07-753045

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HEAT SINK, EXTRUSION, TO-218/TO-

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Shape	Rectangular, Fins
Material	Aluminum Alloy
Product Status	Active
Fin Height	1.772" (45.00mm)
Series	HSE
Type	Board Level
Thermal Resistance @ Forced Air Flow	2.10°C/W @ 200 LFM
Length	2.953" (75.00mm)
Mfr	CUI Devices
Thermal Resistance @ Natural	4.85°C/W
Package	Bag
Material Finish	Black Anodized
Attachment Method	Clip
Width	1.181" (30.00mm)
Diameter	-
Power Dissipation @ Temperature Rise	15.46W @ 75°C
Package Cooled	TO-218, TO-220