HSE12-B20-NP

CUI Devices

Product No:

HSE12-B20-NP

Manufacturer:

Package:

Batch:

Datasheet:

Description:

HEAT SINK, EXTRUSION, TO-218/TO-

Quantity:

Delivery:

Payment:

In Stock : Please Inquiry

Please send RFQ , we will respond immediately.

Contact Name

Company name

Telephone

Country

Quantity

Shape	Rectangular
Material	Aluminum Alloy
Product Status	Active
Fin Height	0.177" (4.50mm)
Series	HSE
Type	Top Mount
Thermal Resistance @ Forced Air Flow	19.20°C/W @ 200 LFM
Length	0.984" (25.00mm)
Mfr	CUI Devices
Thermal Resistance @ Natural	38.75°C/W
Package	Bag
Material Finish	Black Anodized
Attachment Method	Bolt On
Width	0.472" (12.00mm)
Diameter	-
Power Dissipation @ Temperature Rise	1.94W @ 75°C
Package Cooled	TO-218, TO-220