HSS-B20-061H-03

CUI Devices

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HSS-B20-061H-03

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HEATSINK TO-220 2.9W ALUMINUM

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Shape	Rectangular, Fins
Material	Aluminum
Product Status	Active
Fin Height	0.748" (19.00mm)
Series	HSS
Thermal Resistance @ Forced Air Flow	5.72°C/W @ 200 LFM
Type	Board Level
Length	0.512" (13.00mm)
Mfr	CUI Devices
Thermal Resistance @ Natural	25.86°C/W
Package	Bag
Material Finish	Black Anodized
Attachment Method	PC Pin
Width	0.512" (13.00mm)
Diameter	-
Power Dissipation @ Temperature Rise	2.9W @ 75°C
Package Cooled	TO-220
Base Product Number	HSS-B20