HSS02-B20-P318

CUI Devices

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HSS02-B20-P318

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HEAT SINK, STAMPING, TO-220, 23.

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Shape	Rectangular
Material	Aluminum Alloy
Product Status	Active
Fin Height	0.950" (24.13mm)
Series	HSS
Type	Board Level, Vertical
Thermal Resistance @ Forced Air Flow	4.80°C/W @ 200 LFM
Length	1.900" (48.26mm)
Mfr	CUI Devices
Thermal Resistance @ Natural	10.90°C/W
Package	Box
Material Finish	Black Anodized
Attachment Method	Bolt On and PC Pin
Width	0.930" (23.62mm)
Diameter	-
Power Dissipation @ Temperature Rise	6.9W @ 75°C
Package Cooled	TO-220