HSS07-C20-P274

CUI Devices

Product No:

HSS07-C20-P274

Manufacturer:

Package:

Batch:

Datasheet:

Description:

HEAT SINK, STAMPING, TO-220, 21.

Quantity:

Delivery:

Payment:

In Stock : Please Inquiry

Please send RFQ , we will respond immediately.

Contact Name

Company name

Telephone

Country

Quantity

Shape	Rectangular
Material	Copper Alloy
Product Status	Active
Fin Height	0.515" (13.08mm)
Series	HSS
Type	Board Level, Vertical
Thermal Resistance @ Forced Air Flow	12.60°C/W @ 200 LFM
Length	0.853" (21.66mm)
Mfr	CUI Devices
Thermal Resistance @ Natural	29.57°C/W
Package	Box
Material Finish	Tin
Attachment Method	PC Pin
Width	0.520" (13.21mm)
Diameter	-
Power Dissipation @ Temperature Rise	2.5W @ 75°C
Package Cooled	TO-220